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Infineon, UMC Announce Manufacturing Agreement

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Dec. 15, 2014—The semiconductor manufacturer Infineon Technologies AG and United Microelectronics Corporation announced an extension of their manufacturing partnership into power semiconductors for automotive applications.

Prior to this expanded partnership, the foundry had been producing Infineon's logic chips for more than 15 years. Based on the recently signed agreement, both companies will jointly transfer Infineon's automotive-qualified Smart Power Technology (SPT9) to UMC and extend its production to 300mm wafers. Production start of SPT9 products at UMC's 300mm Fab in Taiwan is planned for early 2018.   

SPT9 is a proprietary 130-nanometer (nm) process technology of Infineon that combines microcontroller intelligence and power technology on a single die.

In 2009, Infineon was the world's first semiconductor manufacturer to offer an automotive-qualified embedded power technology in 130nm technology node that combines complex digital logic circuits, sensor interfaces and power electronics.

SPT9 applications are varied, ranging from intelligent control for small electric motors in vehicles, such as used for power window lifts, wipers, sun roofs, power seats and fan/blower control, oil and water pumps, to airbags, and audio amplifiers.

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